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1

Phase analysis of TaN/Ta barrier layers in sub-micrometer trench structures for Cu interconnects

M. Traving, I. Zienert, E. Zschech, G. Schindler, W. Steinhögl, M. Engelhardt

Journal:

Applied Surface Science

Year:

2005

Language:

english

File:

PDF, 408 KB

english, 2005

2

Evaluation of circuit performance of ultra-thin-body SOI CMOS

Christian Pacha, Artur Schmal, Thomas Schulz, Ralf Göttsche, Werner Steinhögl

Journal:

Solid-State Electronics

Year:

2003

Language:

english

File:

PDF, 259 KB

english, 2003

3

Challenges of interconnection technology till the end of the roadmap and beyond

M Engelhardt, G Schindler, W Steinhögl, G Steinlesberger

Journal:

Microelectronic Engineering

Year:

2002

Language:

english

File:

PDF, 355 KB

english, 2002

4

Angle-resolved study of magnetic dichroism in photoemission using linearly polarized light

Kuch, W., Lin, M.-T., Steinhögl, W., Schneider, C. M., Venus, D., Kirschner, J.

Journal:

Physical Review B

Year:

1995

Language:

english

File:

PDF, 159 KB

english, 1995

5

Size-dependent resistivity of metallic wires in the mesoscopic range

Steinhögl, Werner, Schindler, Günther, Steinlesberger, Gernot, Engelhardt, Manfred

Journal:

Physical Review B

Year:

2002

Language:

english

File:

PDF, 88 KB

english, 2002

6

Tungsten interconnects in the nano-scale regime

W. Steinhögl, G. Steinlesberger, M. Perrin, G. Scheinbacher, G. Schindler, M. Traving, M. Engelhardt

Journal:

Microelectronic Engineering

Year:

2005

Language:

english

File:

PDF, 234 KB

english, 2005

7

The low-energy thermal excitation spectrum of nitrogen molecules adsorbed on Ni(110): Implications for molecular adsorption sites

M. Bertino,W. Steinhögl,H. Range,F. Hofmann,G. Witte,E. Hulpke…

Journal:

Applied Physics A: Materials Science & Processing

Year:

1996

Language:

english

File:

PDF, 249 KB

english, 1996

8

Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects

Steinlesberger, G., Engelhardt, M., Schindler, G., Steinhögl, W., Traving, M., Hönlein, W., Bertagnolli, E.

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 1.00 MB

english, 2003

9

Electrical characterization of copper interconnects with end-of-roadmap feature sizes

G Schindler, G Steinlesberger, M Engelhardt, W Steinhögl

Journal:

Solid-State Electronics

Year:

2003

Language:

english

File:

PDF, 177 KB

english, 2003

10

Electrical assessment of copper damascene interconnects down to sub-50 nm feature sizes

G. Steinlesberger, M. Engelhardt, G. Schindler, W. Steinhögl, A. von Glasow, K. Mosig, E. Bertagnolli

Journal:

Microelectronic Engineering

Year:

2002

Language:

english

File:

PDF, 364 KB

english, 2002

11

Processing technology for the investigation of sub-50 nm copper damascene interconnects

G Steinlesberger, M Engelhardt, G Schindler, J Kretz, W Steinhögl, E Bertagnolli

Journal:

Solid-State Electronics

Year:

2003

Language:

english

File:

PDF, 272 KB

english, 2003

12

Shifting the surface Kohn anomaly of H-saturated Mo(1 1 0) by alloying the bulk with Re

M. Okada, B. Flach, E. Hulpke, W. Steinhögl, E.W. Plummer

Journal:

Surface Science

Year:

2002

Language:

english

File:

PDF, 253 KB

english, 2002

13

Scaling of parasitics and delay times in the backend-of-line

G Schindler, W Steinhögl, G Steinlesberger, M Traving, M Engelhardt

Journal:

Microelectronic Engineering

Year:

2003

Language:

english

File:

PDF, 271 KB

english, 2003

14

Reliability studies of narrow Cu lines

Günther Schindler, Sabine Penka, Gernot Steinlesberger, Martin Traving, Werner Steinhögl, Manfred Engelhardt

Journal:

Microelectronic Engineering

Year:

2005

Language:

english

File:

PDF, 255 KB

english, 2005

15

[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - Air gap technology by selective ozone/TEOS deposition

Gabric, Z., Pamler, W., Schindler, G., Steinhogl, W., Traving, M.

Year:

2004

Language:

english

File:

PDF, 251 KB

english, 2004

16

Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects

Steinlesberger, G., Engelhardt, M., Schindler, G., Steinhögl, W., Traving, M., Hönlein, W., Bertagnolli, E.

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 1.00 MB

2003

17

Carbon nanotubes in interconnect applications

F Kreupl, A.P Graham, G.S Duesberg, W Steinhögl, M Liebau, E Unger, W Hönlein

Journal:

Microelectronic Engineering

Year:

2002

Language:

english

File:

PDF, 817 KB

english, 2002

18

[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - Aluminum nano interconnects

Steinlesberger, G., Schindler, G., Engelhardt, M., Steinhogl, W., Traving, M.

Year:

2004

Language:

english

File:

PDF, 333 KB

english, 2004

19

Successive multilayer desorption from ultrathin alkali-metal films studied with helium-atom scattering

Fuhrmann, D., Hulpke, E., Steinhögl, W.

Journal:

Physical Review B

Year:

1998

Language:

english

File:

PDF, 123 KB

english, 1998

20

Multi-Scale Simulations of Silicon Etching by Halides: Effects of Surface Reaction Rates.

Kratzer, Matthias, Steinhögl, Werner, Kersch, Alfred, Sachse, Tanja, Höink, Volker

Journal:

MRS Proceedings

Year:

2001

Language:

english

File:

PDF, 989 KB

english, 2001

21

Electrical Behavior of Nano-Scaled Interconnects

Engelhardt, M., Schindler, G., Steinhögl, W., Steinlesberger, G., Traving, M.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 302 KB

english, 2004

22

Impact of line edge roughness on the resistivity of nanometer-scale interconnects

W. Steinhögl, G. Schindler, G. Steinlesberger, M. Traving, M. Engelhardt

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 304 KB

english, 2004

23

Characterization of epitaxial rubidium films with helium-atom scattering

B. Flach, E. Hulpke, W. Steinhögl

Journal:

Surface Science

Year:

1998

Language:

english

File:

PDF, 208 KB

english, 1998

24

[IEEE 2004 International Conference on Integrated Circuit Design and Technology - Austin, TX, USA (17-20 May 2004)] 2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866) - Investigation of nano interconnects for an early experimental assessment of future interconnect challenges

Engelhardt, N., Schindler, G., Steinhogl, W., Steinlesberger, G., Traving, M.

Year:

2004

Language:

english

File:

PDF, 315 KB

english, 2004

25

Probing the Magnetic Forces in fcc-Fe(001) Films by Means of Surface Phonon Spectroscopy

Benedek, G., Hulpke, E., Steinhögl, W.

Journal:

Physical Review Letters

Year:

2001

Language:

english

File:

PDF, 93 KB

english, 2001

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